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【Keynote Speech】Application of Artificial Intelligence and Data Science in the IC Packaging and Testing Industry

update date : 2023-06-29

We, at the IAI Program, are honored to have Mr. WU, CHIN-TA, Vice President of Powertech Technology Inc. deliver a keynote speech on the topic of "Applications of Artificial Intelligence and Data Science in the IC Packaging and Testing Industry". Students and members of the Faculty of the University are welcome to join us in this great event!

Venue: Formosa Hall, Floor 1, Innovative Building (No food and drink allowed)

Topic: Application of Artificial Intelligence and Data Science in the IC Packaging and Testing Industry

Speaker: Mr. WU, CHIN-TA, Vice President of Powertech Technology Inc.

Time: 08:30-10:30 on December 7th, 2022

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